IEC 61188-1-2 Ed. 1.0 b:1998
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The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
Product Details
- Edition:
- 1.0
- Published:
- 04/29/1998
- Number of Pages:
- 83
- File Size:
- 1 file , 470 KB
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