Category: IEC
IEC
Semiconductor devices – Micro-electromechanical devices – Part 9: Wafer to wafer bonding strength measurement for MEMS
standard by International Electrotechnical Commission, 07/13/2011
Cores made of soft magnetic materials – Measuring methods – Part 2: Magnetic properties at low excitation level
standard by International Electrotechnical Commission, 03/07/2005
Communication networks and systems for power utility automation – Part 6: Configuration description language for communication in electrical substations related to IEDs
standard by International Electrotechnical Commission, 12/17/2009
Industrial-process control – Safety of analyser houses
standard by International Electrotechnical Commission, 02/24/2015
Low-voltage power supplies, d.c. output – Part 3: Electromagnetic compatibility (EMC)
standard by International Electrotechnical Commission, 11/09/2000
Wireless power transfer – Management – Part 2: Multiple device control management
standard by International Electrotechnical Commission, 06/19/2017
Field Device Integration (FDI) – Part 2: FDI Client
standard by International Electrotechnical Commission, 05/12/2015
Integrated circuits – Manufacturing line approval application guideline
standard by International Electrotechnical Commission, 03/19/1999
Industrial communication networks – Profiles – Part 5-19: Installation of fieldbuses – Installation profiles for CPF 19
standard by International Electrotechnical Commission, 09/09/2013
Fibre optic interconnecting devices and passive components performance standard – Part 101-2: Fibre management systems for Category C – Controlled environment
standard by International Electrotechnical Commission, 09/27/2006