Technical Standard

Semiconductor devices – Time dependent dielectric breakdown (TDDB) test for gate dielectric films
standard by International Electrotechnical Commission, 03/29/2007

Power systems management and associated information exchange – Data and communications security – ALL PARTS
standard by International Electrotechnical Commission, 09/28/2016

Product package labels for electronic components using bar code and two-dimensional symbologies
standard by International Electrotechnical Commission, 11/22/2002

LED modules for general lighting – Safety specifications
standard by International Electrotechnical Commission, 03/08/2018

Standard Test Interface Language (STIL) for Digital Test Vector Data
standard by International Electrotechnical Commission, 11/07/2007

Superconductivity – Residual resistance ratio measurement – Residual resistance ratio of Nb-Ti and Nb₃Sn composite superconductors
standard by International Electrotechnical Commission, 01/19/2016

Materials for printed boards and other interconnecting structures – Part 2-8: Reinforced base materials clad and unclad – Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
standard by International Electrotechnical Commission, 02/27/2003

Live working – Voltage detectors – Part 5: Voltage detecting systems (VDS)
standard by International Electrotechnical Commission, 06/05/1997

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-3: General test methods for materials and assemblies – Soldering paste for printed board assemblies
standard by International Electrotechnical Commission, 01/08/2015

Adjustable speed electrical power drive systems – Part 9-2: Ecodesign for power drive systems, motor starters, power electronics and their driven applications – Energy efficiency indicators for power drive systems and motor starters
standard by International Electrotechnical Commission, 03/03/2017