Category: IEC

IEC

IEC 61169-32 Ed. 1.0 b:1999

IEC 61169-32 Ed. 1.0 b:1999

Radio-frequency connectors – Part 32: RF coaxial connectors with inner diameter of outer conductor 1,85 mm (0,072 in) with screw coupling – Characteristic impedance 50 ohms (type 1,85)
standard by International Electrotechnical Commission, 07/29/1999

IEC 61892-4 Ed. 1.0 en:2007

IEC 61892-4 Ed. 1.0 en:2007

Mobile and fixed offshore units – Electrical installations – Part 4: Cables
standard by International Electrotechnical Commission, 06/05/2007

IEC 61788-15 Ed. 1.0 b:2011

IEC 61788-15 Ed. 1.0 b:2011

Superconductivity – Part 15: Electronic characteristic measurements – Intrinsic surface impedance of superconductor films at microwave frequencies
standard by International Electrotechnical Commission, 10/24/2011

IEC 61226 Ed. 3.0 b:2009

IEC 61226 Ed. 3.0 b:2009

Nuclear power plants – Instrumentation and control important to safety – Classification of instrumentation and control functions
standard by International Electrotechnical Commission, 07/08/2009

IEC 61375-2-2 Ed. 1.0 b:2012

IEC 61375-2-2 Ed. 1.0 b:2012

Electronic railway equipment – Train communication network (TCN) – Part 2-2: Wire Train Bus conformance testing
standard by International Electrotechnical Commission, 06/21/2012

IEC 61378-2 Ed. 1.0 b:2001

IEC 61378-2 Ed. 1.0 b:2001

Convertor transformers – Part 2: Transformers for HVDC applications
standard by International Electrotechnical Commission, 02/08/2001

IEC 61249-2-36 Ed. 1.0 b:2008

IEC 61249-2-36 Ed. 1.0 b:2008

Materials for printed boards and other interconnecting structures – Part 2-36: Reinforced base materials, clad and unclad – Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
standard by International Electrotechnical Commission, 11/27/2008

IEC 61189-5-4 Ed. 1.0 b:2015

IEC 61189-5-4 Ed. 1.0 b:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-4: General test methods for materials and assemblies – Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
standard by International Electrotechnical Commission, 01/08/2015

IEC 61850-3 Ed. 2.0 b:2013

IEC 61850-3 Ed. 2.0 b:2013

Communication networks and systems for power utility automation – Part 3: General requirements
standard by International Electrotechnical Commission, 12/12/2013

IEC 61249-2-35 Ed. 1.0 b:2008

IEC 61249-2-35 Ed. 1.0 b:2008

Materials for printed boards and other interconnecting structures – Part 2-35: Reinforced base materials, clad and unclad – Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
standard by International Electrotechnical Commission, 11/27/2008