Category: IEC
IEC
Methods of measuring the characteristics of reproducing equipment for digital audio compact discs
standard by International Electrotechnical Commission, 09/30/1992
Connectors for use in d.c., low-frequency analogue and digital high speed data applications – Part 3-100: Rectangular connectors with assessed quality – Detail specification for a range of shielded connectors with trapezoidal-shaped shells and non-removable ribbon contacts on a 1,27 mm double row
standard by International Electrotechnical Commission, 11/16/1999
Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)
standard by International Electrotechnical Commission, 04/10/2006
Fibre optic interconnecting devices and passive components performance standard – Part 1: General and guidance for performance standards
standard by International Electrotechnical Commission, 07/01/2019
Materials for printed boards and other interconnecting structures – Part 2-11: Reinforced base materials, clad and unclad – Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
standard by International Electrotechnical Commission, 11/12/2003
Ultrasonics – Power measurement – Radiation force balances and performance requirements
standard by International Electrotechnical Commission, 12/13/2006
Industrial communication networks – Fieldbus specifications – Part 4-4: Data-link layer protocol specification – Type 4 elements
standard by International Electrotechnical Commission, 12/14/2007
Liquid crystal and solid-state display devices – Part 1: Generic specification CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 05/15/2003
Industrial communication networks – Fieldbus specifications – Part 6-14: Application layer protocol specification – Type 14 elements
standard by International Electrotechnical Commission, 12/14/2007
Powertrack systems – Part 1: General requirements
standard by International Electrotechnical Commission, 05/18/2011