Category: IEC

IEC

IEC 60601-2-6 Ed. 2.0 b:2012

IEC 60601-2-6 Ed. 2.0 b:2012

Medical electrical equipment – Part 2-6: Particular requirements for the basic safety and essential performance of microwave therapy equipment
standard by International Electrotechnical Commission, 04/27/2012

IEC 60539-1 Ed. 1.0 en:2002

IEC 60539-1 Ed. 1.0 en:2002

Directly heated negative temperature coefficient thermistors – Part 1: Generic specification
standard by International Electrotechnical Commission, 02/26/2002

IEC 60737 Ed. 2.0 b:2010

IEC 60737 Ed. 2.0 b:2010

Nuclear power plants – Instrumentation important to safety – Temperature sensors (in-core and primary coolant circuit) – Characteristics and test methods
standard by International Electrotechnical Commission, 06/28/2010

IEC 60947-8 Ed. 1.1 b:2006

IEC 60947-8 Ed. 1.1 b:2006

Low-voltage switchgear and controlgear – Part 8: Control units for built-in thermal protection (PTC) for rotating electrical machines CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 11/24/2006

IEC 60748-20 Ed. 1.0 b:1988

IEC 60748-20 Ed. 1.0 b:1988

Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
standard by International Electrotechnical Commission, 06/30/1988

IEC 60730-2-6 Ed. 3.0 b:2015

IEC 60730-2-6 Ed. 3.0 b:2015

Automatic electrical controls – Part 2-6: Particular requirements for automatic electrical pressure sensing controls including mechanical requirements
standard by International Electrotechnical Commission, 04/22/2015

IEC 60352-1 Ed. 3.0 b:1997

IEC 60352-1 Ed. 3.0 b:1997

Solderless connections – Part 1: Wrapped connections – General requirements, test methods and practical guidance
standard by International Electrotechnical Commission, 08/06/1997

IEC 60695-8-2 Ed. 1.0 b:2016

IEC 60695-8-2 Ed. 1.0 b:2016

Fire hazard testing – Part 8-2: Heat release – Summary and relevance of test methods
standard by International Electrotechnical Commission, 11/16/2016

IEC 60917-2-3 Ed. 1.0 en:2006

IEC 60917-2-3 Ed. 1.0 en:2006

Modular order for the development of mechanical structures for electronic equipment practices – Part 2-3: Sectional specification – Interface co-ordination dimensions for the 25 mm equipment practice – Extended detail specification – Dimensions for subracks, chassis, backplanes, front panels and plu
standard by International Electrotechnical Commission, 05/09/2006

IEC 60748-2-7 Ed. 1.0 b:1992

IEC 60748-2-7 Ed. 1.0 b:1992

Semiconductor devices. Integrated circuits – Part 2: Digital integrated circuits – Section seven: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories
standard by International Electrotechnical Commission, 10/23/1992