IEC 61163-1 Ed. 2.0 b:2006
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This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable.
Product Details
- Edition:
- 2.0
- Published:
- 06/26/2006
- Number of Pages:
- 161
- File Size:
- 1 file , 1.4 MB
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