IEC 61193-1 Ed. 1.0 b:2001
Click here to purchase
Defines methods of registration and analysis of defects on soldered printed board assemblies. These methods are described to allow effective comparison of performance between products, processes and production locations, and can serve as a basis for general quality improvement.
Product Details
- Edition:
- 1.0
- Published:
- 12/19/2001
- Number of Pages:
- 41
- File Size:
- 1 file , 1000 KB
Connectors for electrical and electronic equipment – Part 7: Detail specification for up to 7 ways including PE or FE (data/power) and shield pin, free and fixed circular connectors for balanced single-pair data transmission with current-carrying capacity – Mechanical mating information, pin assignment and additional requirements for type 7
standard by International Electrotechnical Commission, 05/01/2023
Electric welding equipment – Assessment of restrictions related to human exposure to electromagnetic fields (0 Hz to 300 Hz) – Part 3: Resistance welding equipment
standard by International Electrotechnical Commission,