IEC 62047-25 Ed. 1.0 b:2016

Posted on: 09/12/202012/20/2019
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IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.

Product Details

Edition:: 1.0
Published:: 08/29/2016
Number of Pages:: 45
File Size:: 1 file , 1000 KB

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